Polyurethane Hot Melt Glue PUR Hot Glue For Smartphones & 5G Modules Flame Retardant

PUR For Smartphones & 5G Modules / 5G PUR Adhesive / 5G Communication Applications Adhesive

Descripition:

UH-0608B is a single-component reactive polyurethane adhesive that complies with REACH and UL94 V0 standards.

This product is mainly used for potting and rapid position setting of electronic products, Battery-PCB circuit board protection and heat dissipation. This product exhibits stable performance, superior thermal conductivity and flame-retardant performance while meeting the needs of high-speed production line applications.

Usage Instructions:

UH-0608B is a one-component thermally conductive flame-retardant PUR adhesive rarely seen in the adhesive industry. In particular, the product has a short solidification time; bonding and demolding can be completed within 20 seconds after potting, and even thick films do not produce bubbles during the curing process. In addition, after fully curing the product can maintain original size under high temperature conditions of 80-120℃, with no warping or bubbling phenomenon. Besides fast potting and fast bonding to substrates.

Specification:

Smartphones Polyurethane Hot Melt Glue

5G Modules PUR Hot Glue

Flame Retardant Polyurethane Hot Melt Glue

Polyurethane Hot Melt Glue PUR Hot Glue For Smartphones & 5G Modules Flame Retardant Images